超越镍/金:电子领域用下一代耐腐蚀表面精饰工艺  

Beyond Ni/Au:Next Generation Corrosion Resistant Finishes for Electronics Applications

作　　者：闻春国(译) WEN Chun-guo

机构地区：[1]四川华丰企业集团有限公司,四川绵阳621000

出　　处：《机电元件》2020年第5期19-23,共5页Electromechanical Components

摘　　要：本文介绍了几种新一代的提高电镀制品耐腐蚀性的方法,即用各种方法寻找替代镍/金工业标准的表面处理方法。电镀层的一个主要功能就是提高基体和(或)其它被镀层的耐腐蚀性。在电子应用中,这一点非常重要,因为对可靠性的要求越来越高,因此需要执行更严格的规范要求,尤其是在防腐蚀方面。几十年来,传统的电镀镍加硬金的行业标准在电子电镀行业许多领域得到了很好的应用,现在正被一些应用中的替代品所取代,以满足这些新的技术要求。通过几种不同的方法可以提高电镀电子器件的耐腐蚀性。本文将介绍几种新一代方法,以提高电镀制品的耐腐蚀性,使用各种方法寻找替代镍/金工业标准的精饰表面。One of the major functions of electroplated coatings is to increase the corrosion resistance of the substrate and/or other layers that the coating is being applied to.This is extremely important in electronics applications where increasing demands on reliability result in implementation of more stringent requirements,particularly with regard to corrosion protection.The industry standard of conventional electroplated nickel plus hard gold,that has served many portions of the electronics plating industry well for several decades,is now being replaced by alternatives in several applications in order to satisfy these new requirements.Increasing the corrosion resistance of an electroplated electronic device can be achieved through several different means.This paper will describe several next generation approaches to increasing the corrosion-resistance of electroplated articles using various methods in the search for finishes to replace the Ni/Au industry standard.

关 键 词：电连接器 镍/金镀层 耐腐蚀 表面精饰 

分 类 号：TN784[电子电信—电路与系统]