氨基桥联有机硅对Ag^+的吸附性能及传质机理研究  

ADSORPTION PROPERTIES AND TRANSPORT MECHANISM OF AMINE-BRIDGED ORGANOSILICAS FOR Ag^+

作　　者：黄劲荣[1] 任秀秀 孙雪妮 左士祥[1] 姚超[1] 徐荣[1] 钟璟[1] HUANG Jingrong;REN Xiuxiu;SUN Xueni;ZUO Shixiang;YAO Chao;XU Rong;ZHONG Jing(Jiangsu Key Laboratory of Advanced Catalytic Materials and Technology School of Petrochemical,ngineering,Changzhou University,Changzhou 213164,China)

机构地区：[1]常州大学石油化工学院江苏省绿色催化材料与技术重点实验室,江苏常州213164

出　　处：《离子交换与吸附》2020年第2期136-147,共12页Ion Exchange and Adsorption

基　　金：江苏省高校自然科学研究重大项目(18KJA530001);江苏省绿色催化材料与技术重点实验室项目(BM2012110)资助。

摘　　要：利用二-(3-三甲氧基硅基丙基)胺(BTSPA)和正硅酸乙酯(TEOS)共聚,合成了一系列氨基桥联有机硅新型吸附材料。TEOS的加入提高了有机硅网络结构的刚性,有效避免了其孔结构的坍塌。N2吸附和TEM测试结果表明,与以BTSPA为单一硅源前驱体相比,BTSPA和TEOS共聚制备的桥联有机硅吸附剂具有典型的介孔结构,其比表面积和孔体积均显著增大。吸附实验结果表明,共聚合成的氨基桥联有机硅材料对Ag+表现出优异的吸附能力,静态平衡吸附量高达92.05mg/g。此外,吸附等温线符合Freundlich模型,吸附过程遵循拟二级动力学模型,粒内扩散是吸附限速步骤。本研究制备的氨基桥联有机硅作为高效选择性吸附剂在重金属废水处理中表现出良好的应用前景。A series of new bridged organosilicas functionalized with amine groups have been synthesized via the cocondensation of bis(3-trimethoxysilyl-propyl)amine(BTSPA)and tetraethoxysilane(TEOS).The addition of TEOS could greatly increase the rigidity of the silica network structure,hence avoid the collapse of the pore structure.N2 adsorption and TEM analysis confirmed that compared with the bridged organosilica using BTSPA as a single precursor,bridged organosilicas prepared by cocondensation of BTSPA and TEOS had a typical mesoporous structure with higher specific surface areas and pore volumes.These amine-bridged organosilicas showed excellent selectivity for Ag+in the adsorption experiments,and the static equilibrium adsorption capacities could reach 92.05 mg/g.Furthermore,the adsorption isotherm was in accordance with the Freundlich model,and the adsorption process followed well the Pseudo-second-order model.Intraparticle diffusion was the rate-limiting step during the adsorption of Ag+.The amine-bridged organosilicas show great promise as highly selective sorbents for the application in treatment of wastewater containing heavy metal ions.

关 键 词：桥联有机硅 共聚 吸附 介孔 Ag+ 

分 类 号：TQ424.26[化学工程]