聚合物银导体浆料的研制  

Development of Polymer Silver Conductor Paste

作　　者：李宏杰 王靖 冀亮君 LI Hong-jie;WANG Jing;JI Liang-jun(Xi'an Chuanglianhongsheng Electronic Co.Ltd.,Xi'an 710065,China)

机构地区：[1]西安创联宏晟电子有限公司,西安710065

出　　处：《贵金属》2020年第S01期76-79,共4页Precious Metals

摘　　要：研制了一种低温固化的聚合物银导体浆料。研究了片状银粉直径、分散剂用量及固化剂用量对导体浆料性能的影响。结果表明,当片状银粉直径为8~10μm,分散剂用量(质量分数)为2%,固化剂用量在10%时,所得银浆料的印刷性能、方阻、附着力、室温存储性能等各项指标符合要求。A polymer silver conductor slurry cured at low temperature was developed.The effects of the diameter of flake silver powder,the amount of dispersant and the amount of hardener on the properties of conductor paste were studied.And it turns out,.When the diameter of flake silver powder is 8-10 m,the dosage(mass fraction)of dispersant is 2%,and the dosage of hardener is 10%,The printing performance,square resistance,adhesion and room temperature storage performance of the silver paste met the requirements.

关 键 词：金属材料 银浆 性能 环氧树脂 固化 片状银粉 

分 类 号：TM241[一般工业技术—材料科学与工程]