基于FA/OⅡ螯合剂的复配清洗液去除Cu-BTA的研究  

Study on the Removal of Cu-BTA by the Compound Cleaning Solution Based on FA/OⅡChelating Agent

作　　者：张师浩 檀柏梅 王亚珍 王淇 田思雨 Zhang Shihao;Tan Baimei;Wang Yazhen;Wang Qi;Tian Siyu(School of Electronic and Information Engineering,Hebei University of Technology,Tianjin 300130,China;Tianjin Key Laboratory of Electronic Materials and Devices,Tianjin 300130,China)

机构地区：[1]河北工业大学电子信息工程学院,天津300130 [2]天津市电子材料与器件重点实验室,天津300130

出　　处：《半导体技术》2020年第10期782-789,共8页Semiconductor Technology

基　　金：国家科技重大专项资助项目(2016ZX02301003-004-007);河北省自然科学基金资助项目(F2018202174)。

摘　　要：在减少清洗液对晶圆表面腐蚀的前提下,尽可能地去除表面残留的苯并三唑(BTA)是Cu互连化学机械抛光(CMP)后清洗的研究重点。选择了两种非离子表面活性剂聚乙二醇辛基苯基醚(Triton X-100)和脂肪醇聚氧乙烯醚(AEO-20)与质量分数为0.02%的FA/OⅡ螯合剂复配成碱性清洗剂,研究其对Cu表面BTA的去除效果,对其作用机理进行了分析。接触角和电化学测试结果表明,两种清洗剂均改善了Cu表面Cu-BTA的去除效果。其中FA/OⅡ螯合剂与质量分数为0.22%的Triton X-100复配清洗Cu表面后,接触角降为37.75°,腐蚀电流密度增大到2.424×10-6 A/cm2;与质量分数为0.25%的AEO-20复配清洗Cu表面后,接触角降为32.5°,腐蚀电流密度增大到2.657×10-6 A/cm2;当AEO-20与FA/OⅡ复配清洗液pH值为10.5时,几乎不影响BTA的去除效果,但Cu表面的粗糙度降至5.59 nm。While reducing the corrosion caused by the cleaning solution,removing benzotriazole(BTA)as much as possible from the surface of the wafer is the research focus for post chemical mechanical polishing(CMP)cleaning of Cu interconnection.Two kinds of nonionic surfactants(Triton X-100 and AEO-20)were mixed with the FA/OⅡchelating agent of 0.02%mass fraction into alkaline cleaning solution.The removal effect of BTA on Cu surface and the removal mechanism were also analyzed.The results of contact angle and electrochemical measurements show that both of the two compound cleaning solutions improve the removal efficiency of Cu-BTA on Cu surface.When the FA/OⅡchelating agent is mixed with the Triton X-100 of 0.22%mass fraction into the compound cleaning solution to clean the Cu surface contaminated by BTA,the contact angle decreases to 37.75°and the corrosion current density increases to 2.424×10-6 A/cm2.When the FA/OⅡchelating agent is mixed with the AEO-20 of 0.25%mass fraction into compound cleaning solution to clean the Cu surface contaminated by BTA,the contact angle decreases to 32.5°and the corrosion current density increases to 2.657×10-6 A/cm2.When the pH value of the compound cleaning solution of AEO-20 and FA/OⅡis 10.5,the removal effect of BTA is almost unaffected,and the surface roughness of Cu reduces to 5.59 nm.

关 键 词：复配清洗剂 Cu苯并三唑(BTA) FA/OⅡ螯合剂 聚乙二醇辛基苯基醚(Triton X-100) 脂肪醇聚氧乙烯醚(AEO-20) 碱性清洗剂 

分 类 号：TN305.2[电子电信—物理电子学]