铜基CPU水冷散热器的散热数值模拟与结构优化  

Numerical simulation and structural optimization of copper-based CPU water cooling radiator

作　　者：王金龙[1] 苑成东 刘昭良 崔大伟[3] WANG Jin-long;YUAN Cheng-dong;LIU Zhao-liang;CUI Da-wei(College of Architecture and Engineering,Weifang University,Weifang 261061,China;College of Mechanical and Electronic Engineering,Shandong University of Science and Technology,Qingdao 266590,China;School of Mechanical-electronic and Vehicle Engineering,Weifang University,Weifang 261061,China)

机构地区：[1]潍坊学院建筑工程学院,山东潍坊261061 [2]山东科技大学机械电子工程学院,山东青岛266590 [3]潍坊学院机电与车辆工程学院,山东潍坊261061

出　　处：《材料热处理学报》2020年第10期155-161,共7页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(51004077);山东省优秀中青年科学家科研奖励基金(BS2010CL046)。

摘　　要：为了增强CPU水冷散热器的散热能力、提高其散热均匀性,通过ANSYS软件对CPU水冷散热器进行数值模拟,研究进出口数量和导流板对翅片式散热器散热效果的影响,并进行结构优化。结果表明,随着进出口数量的增多,CPU温度分布更加均匀;进口导流板结构使得散热器散热能力增强。以0.4 mL·s-1情况下的最低温度和最低压降为优化目标,最优结果出现在20入口、无出口导流板时,此时温度和压降都取到最小值,分别是54.927℃、0.823 Pa。In order to enhance the cooling capacity and uniformity of CPU water-cooled radiator, the CPU water-cooled radiator was numerically simulated by ANSYS software to study the influence of the number of inlet and outlet and the deflector on the heat dissipation effect of the fin radiator, and the structure was optimized. The results show that with the increase of the number of inlets, the temperature distribution of the CPU is more uniform, and the structure of the inlet deflector makes the heat dissipation capacity of radiator enhanced. Taking the lowest temperature and the lowest pressure drop in the case of 0.4 mL·s-1 as the optimization objective, the optimal results appear at 20 inlet and no outlet deflector, at which time the temperature and pressure drop have the minimum value, which are 54.927 ℃ and 0.823 Pa, respectively.

关 键 词：CPU芯片 水冷散热器 数值模拟 结构优化 

分 类 号：TG146.1[一般工业技术—材料科学与工程] TU832.2[金属学及工艺—金属材料]