芯片外引线复合冲模设计  

Design of Compound Die for Chip External Lead

作　　者：白治新 BAI Zhixin(Heilongjiang Tengfei Construction and Installation Co.,Ltd.,Harbin 150000,China)

机构地区：[1]黑龙江省腾飞建筑安装有限责任公司,哈尔滨150000

出　　处：《机械工程师》2020年第11期143-145,共3页Mechanical Engineer

摘　　要：介绍了一种精密复合冲压模具的设计过程,以提高芯片外引线的加工精度和加工表面质量及加工效率为目的,论述了冲压工艺过程设计的基本原理及冲模设计的基本方法,并对复合模的结构设计要点作了详细阐述。This paper discusses the design process of a precision compound stamping die,which can improve the machining accuracy,surface quality and efficiency of the chip outer lead.The basic principle of the stamping process design and the basic method of the die design are introduced,and the key points of the structural design of the compound die are expounded.

关 键 词：复合模 凹凸模 板料冲压 

分 类 号：TG385.2[金属学及工艺—金属压力加工]