元胞自动机法在累积叠轧镁合金界面连接机制的应用  

Application of cellular automata method to interface bonding mechanism of accumulative rolled magnesium alloy

作　　者：肖心萍[1] 王红梅[1] 李晓丹 Xiao Xinping;Wang Hongmei;Li Xiaodan(Qinhuangdao vocational and Technical College,Department of mechanical and electrical engineering,HebeiQinhuangdao 066100)

机构地区：[1]秦皇岛职业技术学院机电工程系,河北秦皇岛066100

出　　处：《科技风》2020年第32期167-169,共3页

基　　金：秦皇岛市科学技术研究与发展计划立项课题——基于元胞自动机方法的镁合金叠轧界面微观组织数值模拟的研究(项目编号:201902A018)。

摘　　要：本文中采用的累积叠轧焊工艺对镁合金进行细化晶粒,并改善其力学性能。采用元胞自动机法对镁合金界面连接机制进行研究,构建界面扩散模型,分析扩散机理。采用元胞自动机方法对镁合金界面连接机制进行研究,将会对构建界面扩散连接模型的建立,微观组织的研究起到非常重要的作用。将在未来对镁合金在性能优化,实际应用做出突出的贡献。In this paper,the accumulative roll bonding process is used to refine the grain size of magnesium alloy and improve its mechanical properties.The interface bonding mechanism of magnesium alloy was studied by cellular automata method,and the interface diffusion model was established to analyze the diffusion mechanism.The research on the interface bonding mechanism of magnesium alloy by cellular automata will play an important role in the establishment of interface diffusion bonding model and the study of microstructure.It will make outstanding contribution to the performance optimization and practical application of magnesium alloy in the future.

关 键 词：累积叠轧焊 元胞自动机 扩散 连接机制 

分 类 号：TG1[金属学及工艺—金属学]