热压温度对石墨烯铜基复合材料组织及性能的影响  

Effects of Hot Pressing Temperature on Microstructure and Properties of Graphene Copper Matrix Composites

作　　者：张鑫 彭坤[1,2] 曹二斌 高权 宋满新 ZHANG Xin;PENG Kun;CAO Erbin;GAO Quan;SONG Manxin(Institute of Material Science and Engineering,Hu'nan University,Changsha 410082,China;Hu'nan Engineering Technology Research Center for Microwave Devices and Equipment,Hu'nan Aerospace Chengyuan Precision Machinery Co.,Ltd.,Changsha 410205,China)

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082 [2]湖南航天诚远精密机械有限公司湖南省微波器件与装备工程技术研究中心,湖南长沙410205

出　　处：《热加工工艺》2020年第16期82-85,89,共5页Hot Working Technology

基　　金：国家自然科学基金资助项目(51571087)。

摘　　要：采用粘结混粉、真空热压烧结的方法制备石墨烯铜基复合材料,研究了不同热压温度对石墨烯铜基复合材料物相与组织形貌、致密度、导电性、导热性及力学性能的影响。结果表明:石墨烯在铜基体中实现了均匀分散,且两者界面结合紧密。随着热压温度的升高,复合材料的致密度、导电性、导热性及力学性能均先升高后降低。当热压温度为900℃时,制备的复合材料致密化高,孔隙率低,综合性能最优异,复合材料的致密度、导电率、导热率、显微硬度、屈服强度、抗拉强度分别为98.2%、93.2%IACS、411.0 W·m-1·K-1、85.3 HV、128.8 MPa、253.8 MPa。Graphene copper matrix composites were prepared by bonding powder mixing and vacuum hot pressing sintering. The effects of different hot pressing temperature on the phase and microstructure, density, conductivity, thermal conductivity and mechanical properties of graphene copper matrix composites were studied. The results show that, graphene is uniformly dispersed in copper matrix and the interface between graphene and graphene is close. With the increase of hot pressing temperature, the density, conductivity, thermal conductivity and mechanical properties of the composites increase first and then decrease. When the hot pressing temperature is 900 ℃, the composites have the advantages of high densification, low porosity and excellent comprehensive properties. The density, conductivity, thermal conductivity, microhardness, yield strength and tensile strength of the composites are 98.2%, 93.2%IACS, 411.0 W·m-1·K-1, 85.3 HV, 128.8 MPa, 253.8 MPa,respectively.

关 键 词：石墨烯 铜基复合材料 热压温度 组织与性能 

分 类 号：TB333.11[一般工业技术—材料科学与工程]