无机导热粒子对铝基板导热性能的影响  

Effect of Inorganic Thermally Conductive Particles on Thermal Conductivity of Aluminum Substrate

作　　者：吴小青 秦会斌[1] WU Xiaoqing;QIN Huibin(Institute of Electron Device&Application,Hangzhou Dianzi University,Hangzhou 310018,China)

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,杭州310018

出　　处：《电子器件》2020年第5期973-977,990,共6页Chinese Journal of Electron Devices

摘　　要：随着电子信息产业的高速发展,对铝基板覆铜板导热性能的要求也越来越高,提升铝基板覆铜板导热率的关键在于提高绝缘层的导热率。绝缘层以环氧树脂为基体材料,填充的无机导热粒子间通过相互接触形成三维导热网络通路,从而提升铝基覆铜板的导热性能。实验结果表明,当基体材料与主要填充的三种无机陶瓷导热粒子的比例达到EP∶BN∶AlN∶Al2O3=1.9∶1∶3∶6时,绝缘层的导热系数最终可以达到2.8 W/(m·K)。With the rapid development of the electronic information industry,the requirements for the thermal conductivity of aluminum substrate copper-clad laminates are becoming higher and higher.The key to improving the thermal conductivity of aluminum substrate copper-clad laminates is to increase the thermal conductivity of the insulating layer.The insulating layer is made of epoxy resin as a matrix material,and the filled inorganic thermal conductive particles form a three-dimensional thermal conductive network path through mutual contact,thereby improving the thermal conductivity of the aluminum-based copper-clad board.The experimental results show that when the ratio of the matrix material to the three filled inorganic ceramic thermally conductive particles reaches EP∶BN∶AlN∶Al2O3=1.9∶1∶3∶6,the thermal conductivity of the insulating layer can finally reach 2.8 W/(m·K).

关 键 词：导热网链 无机粒子 环氧树脂 导热率 

分 类 号：TN305.94[电子电信—物理电子学]