运用倒装COB封装及黑色半固化片的Mini-LED板  

The mini-LED board with flip COB packaging and black prepreg

作　　者：程胜伟 党晓坤 向华 杨俊 Chen Shengwei;Dang Xiaokun;Xaing Hua;Yang Jun

机构地区：[1]惠州中京电子科技有限公司,广东惠州519029

出　　处：《印制电路信息》2020年第10期52-55,共4页Printed Circuit Information

摘　　要：现阶段LED显示屏应用越来越广泛,LED拼接屏板Pitch也逐渐变小,随之出现新的技术应用,及不同封装方式。文章介绍一款Pitch为0.9 mm,采用倒装COB封装及应用黑色半固化片的Mini-LED板。At the present stage,LED display is more and more widely used.The pitch of LED board is also becoming smaller,and new technology applications and different packaging methods are emerging.This paper introduces a kind of Mini-LED board with 0.9 mm pitch and flip COB packaging,and black prepreg.

关 键 词：小发光二级管板 黑半固化片 倒装载芯片板 

分 类 号：TN41[电子电信—微电子学与固体电子学]