酸性蚀刻液电解回收铜工艺条件的研究  

Study on process conditions of electrolytic recovery of copper by acid etching solution

作　　者：汪前程 黄文涛 李再强 张伟奇 Wang Qianchen;Huang Wentao;Li Zaiqiang;Zhang Weiqi(Shenzhen Qixin Tianzheng Environmental Protection Technology Co.,Ltd ShenZhen GuangDong 518000 China)

机构地区：[1]深圳市祺鑫天正环保科技有限公司,广东深圳518000

出　　处：《印制电路信息》2020年第10期60-63,共4页Printed Circuit Information

摘　　要：蚀刻废液电解过程中,蚀刻液中的铜离子在阴极表面还原析出金属铜,同时,由于蚀刻液的反蚀作用,金属铜又会重新溶解,只有当铜的电析出速度大于溶解速度时,阴极才会有铜层沉积。以阴极电解铜沉积的电流效率、沉积速率为评价指标,通过系列的控制变量实验,对比分析铜离子浓度、阴极电流密度等条件的最佳控制范围。During the electrolytic process of waste etching liquid,copper ions are reduced to metallic copper on the surface of the cathode.At the same time,due to the etching effect of the electrolyte,the copper metal will be dissolved again.Copper can only be deposited on the cathode when the rate of copper precipitation is faster than the rate of dissolution.Through a series of experiments,the cathode current efficiency and deposition rate are used as evaluation indicators to compare and determine the optimal range for conditions such as copper ion concentration and current density.

关 键 词：废蚀刻液 电沉积 电流效率 沉积速率 

分 类 号：TN41[电子电信—微电子学与固体电子学]