集成电路制程用高低端石英承载器退火工艺比较研究  

Comparative Study on Annealing Process of High and Low End Quartz Carriers in Ic Manufacturing

作　　者：谷巨明 樊立强 陈春明 李新 秦卫光 赵介堂 GU Juming;FAN Liqiang;CHEN Chunming;LI Xin;QIN Weiguang;ZHAO Jietang(QuickGem Optoelectronic S&T Co.,Ltd.,Langfang 065001,China)

机构地区：[1]久智光电子材料科技有限公司,廊坊065001

出　　处：《玻璃》2020年第11期37-41,共5页Glass

基　　金：河北省重点研发计划项目(19211108D)。

摘　　要：全球集成电路制备用8英寸及以上石英承载器等器件制品技术主要被国外几家公司所垄断。针对久智公司已有的6英寸石英承载器和新研制的8英寸高端石英承载器产品,就制备技术中关键的退火工艺进行了比较研究,分析了卧、立式退火炉体的结构特点、6英寸和8英寸两种规格产品的适宜退火炉选择,并通过高低端两种规格尺寸退火工艺温度曲线和应力结果的研究,初步确定了8英寸及以上高端石英承载器制备流程中的退火工艺,为国产化8英寸及以上集成电路用高端石英承载器产品奠定了较好的基础。8-inch and above size quartz carrier parts applied for global IC manufacturing have always been monopolized by few foreign companies,in view of which,high-end 8 inch quartz carrier has been newly developed by Quickgem co.based on the matured process for low-end 6 inch carrier products.Conducted a comparative study on annealing process-key technology for preparation,between 6-inch and newly made 8-inch quartz carriers,including analysis in terms of structural features for horizontal and vertical annealing furnaces;investigation related to annealing furnace selection suitable for different specifications of 6 inch and 8 inch carriers;as well as research on the annealing process curve and stress results concerning two various specification of carriers.The trials results show that the annealing process and parameters were basically determined for 8-inch and above size quartz carriers,which laid a good foundation for realizing localization for IC used high-end 8 inch and above quartz carrier parts.

关 键 词：光通讯集成电路 8英寸及以上石英承载器 退火工艺 国产化 

分 类 号：TQ171.72[化学工程—玻璃工业]