大功率电气元件封装用有机硅灌封胶的研制  

Preparation of Silicone Encapsulant for High-power Electrical Components

作　　者：曹鹤 柏卉芷 赵洁 CAO He;BAI Hui-zhi;ZHAO Jie(Tangshan Sanyou Silicon Industry Co.,Ltd.,Tangshan 063305,Hebei;Hebei Provincial New Material Technology Innovation Center of Silicone,Tangshan 063305,Hebei)

机构地区：[1]唐山三友硅业有限责任公司,河北唐山063305 [2]河北省有机硅新材料技术创新中心,河北唐山063305

出　　处：《有机硅材料》2020年第6期16-19,共4页Silicone Material

基　　金：河北省重点研发项目(17211410)。

摘　　要：以端乙烯基硅油、侧链低含氢硅油、球形氧化铝等为原料,制得大功率电气元件封装用有机硅灌封胶,讨论了球形氧化铝的用量及复配比例、增粘剂用量等对有机硅灌封胶性能的影响。结果表明,将中位粒径为4μm和20μm的球形氧化铝复配,且其用量分别为300份和200份,增粘剂C102用量为1.2份时,可制得热导率达1.36 W/(m·K)、剪切强度2.06 MPa的灌封胶,胶料流动性及电气强度等指标均满足大功率电气元件封装要求。Using vinyl-terminated silicone oil as the base polymer,side chain hydrogen-containing silicone oil as the crosslinking agent,and spherical alumina as the thermally conductive filler,a high-power silicone encapsulant for electrical components was prepared.The influence of the amounts and compounding ratio of spherical alumina,and the amounts of tackifier on the performance of encapsulant has been investigated.The results show that when the amount of spherical alumina with a particle size of 4μm is 300 phr,the amount of spherical alumina with a particle size of 20μm is 200 phr,and the amounts of tackifier is 1.2 phr,the prepared encapsulant has the best performance and the thermal conductivity reaches 1.36 W/(m·K),the shear strength reaches 2.06 MPa,and the flowability and electrical strength of the rubber meet the packaging requirements of high-power electrical components.

关 键 词：有机硅灌封胶 导热粘接 球形氧化铝 大功率电气元件 

分 类 号：TQ433.438[化学工程]