检索规则说明:AND代表“并且”;OR代表“或者”;NOT代表“不包含”;(注意必须大写,运算符两边需空一格)
检 索 范 例 :范例一: (K=图书馆学 OR K=情报学) AND A=范并思 范例二:J=计算机应用与软件 AND (U=C++ OR U=Basic) NOT M=Visual
作 者:梅亮[1] 赵鹏[1] 高会壮 MEI Liang;ZHAO Peng;GAO Huizhuang(China Aerospace Science&Industry Corp Defense Technology R&T Center,Beijing 100854)
机构地区:[1]航天科工防御技术研究试验中心,北京100854
出 处:《舰船电子工程》2020年第10期142-144,177,共4页Ship Electronic Engineering
摘 要:系统级封装(System In a Package,SiP)器件结构及功能具有复杂性,对该类器件的可靠性评价还缺乏统一的标准和规范,随着新研SiP器件的大量出现,缺乏相应评价手段与工程应用需求等矛盾日显突出。为此,开展对SiP器件典型失效模式与失效机理分析工作,确定器件薄弱环节,并设计SiP功能运行状态监测系统,实现状态实时监测,避免了无法准确掌握器件试验过程中失效情况。为该类器件提供可靠性评价手段,提高器件使用可靠性。The structure and function of System In a Package(SiP)components are complex,and there is no uniform standard and specification for the reliability evaluation of such components.With the emergence of a large number of newly developed SiP components,the contradiction between the lack of corresponding evaluation means and the demand for engineering application be⁃comes increasingly prominent.To this end,the analysis of typical failure mode and failure mechanism of SiP components is carried out to determine the weak links of the devices,and the functional running state monitoring system of SiP components is designed to realize real-time monitoring of the running state.This avoids the inability to accurately grasp the failure conditions during the test.It provides a reliability evaluation method for this kind of devices and improves their reliability.
关 键 词:SiP器件 失效模式 失效机理 电性能表征参数 运行状态监测
分 类 号:N945[自然科学总论—系统科学]
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在载入数据...
正在链接到云南高校图书馆文献保障联盟下载...
云南高校图书馆联盟文献共享服务平台 版权所有©
您的IP:216.73.216.3