高集成有源阵面多功能微波数字复合基板设计  

A Design of High Integrated Multifunctional Microwave Digital Composite Board of Active Phased Array Antenna

作　　者：闫超[1] 詹珍贤[1] 唐永福[1] YAN Chao;ZHAN Zhenxian;TANG Yongfu(The 38th Research Institute of CETC,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第38研究所,合肥230031

出　　处：《电子信息对抗技术》2020年第6期100-104,共5页Electronic Information Warfare Technology

摘　　要：描述了一种基于多层微波数字复合基板技术的Ka频段高集成度有源相控阵天线多功能微波数字复合基板。基板内集成天线辐射阵面、射频馈电网络、电源分配网络、波控分配网络等电路。文章对多功能板中的关键微波电路与互联方式进行仿真优化分析,仿真结果表明设计指标均较好地满足系统指标要求。多功能板尺寸仅为173 mm×40 mm×3.4 mm,总重量小于60 g,在体积重量严格受限的平台具有良好的应用前景。A Ka-band high integrated multifunctional board of active phased array antenna is proposed based on multi-layer microwave and digital composite board technology.Antenna radiation array,RF feed network,power divider network,wave control divider network and other circuits are integrated in the board.The key microwave circuits and interconnections in the multifunctional board are analyzed and optimized by simulation software.The simulation results show that the design indexes meet the requirements of the system appropriately.The size of multifunctional board is only 173 mm×40 mm×3.4 mm,and the total weight is less than 60 g,which has a good application prospect in the platforms with strict limitation of volume and weight.

关 键 词：高集成度 有源相控阵天线 多功能微波数字复合基板 

分 类 号：TN821.8[电子电信—信息与通信工程]