高性能计算机组装结构分析  

Assembly Structure Analysis of High Performance Computer

作　　者：罗煜峰[1] 李晋文[1] LUO Yufeng;LI Jinwen(School of Computer Science,National University of Defence Technology,Changsha 410073,China)

机构地区：[1]国防科技大学计算机学院,湖南长沙410073

出　　处：《机械与电子》2020年第11期3-7,共5页Machinery & Electronics

基　　金：国家重点研究发展计划(2018YFB0204301)。

摘　　要：根据高性能计算机的计算插件及背板的组装结构设计,提出将高性能计算机的组装结构分为4类。针对TOP500榜单前10名系统的组装结构参数,对各种组装结构进行了分析。指出随着芯片性能的提高,液冷散热技术的广泛使用和技术的成熟,有背板双面组装结构可以有效提高组装密度。Based on the design of the assembly structure of the computing plug-in and the backplane of the high-performance computer,this paper proposes to divide the assembly structure of the high-performance computer into four categories.According to the assembly structure parameters of top ten systems in Top500 List,various assembly structures are analyzed.It is pointed out that with the improvement of chip performance,the widespread use of liquid cooling technology and the maturity of liquid cooling technology,the double-sided assembly structure with backplane can effectively increase the assembly density.

关 键 词：高性能计算机 组装结构 高密度组装 TOP500 

分 类 号：TP338.4[自动化与计算机技术—计算机系统结构]