硅溶胶对水性环氧树脂分散体性能的影响  

Effect of Silica Sol on Properties of Waterborne Epoxy Resin Dispersion

作　　者：官慧 刘文杰 陈淼 GUAN Hui;LIU Wen-jie;CHEN Miao(Guangzhou Jitai Chemical Co.,Ltd.,Guangdong Guangzhou 510530,China)

机构地区：[1]广州集泰化工股份有限公司,广东广州510530

出　　处：《广州化工》2020年第22期66-68,137,共4页GuangZhou Chemical Industry

摘　　要：将自制的硅溶胶加入到水性环氧树脂分散体当中,讨论了不同量硅溶胶的加入对水性环氧树脂分散体的稳定性、水溶性、粘度以及粒径的影响。并用水性固化剂D-230对水性环氧树脂分散体进行固化,讨论不同硅溶胶量的加入对水性环氧树脂固化后涂层的硬度、柔韧性、耐水性、耐酸碱性以及防腐性能的影响。热降解曲线表明,随着硅溶胶含量的增多,改性水性环氧树脂分散体的热降解温度逐渐升高。并且使水性环氧树脂在500℃时的残存量由8.96%提高到17.19%。The self-made silica sol was added to the waterborne epoxy resin dispersion,and the effects of different silica sol on the stability,water solubility,viscosity and particle size of the waterborne epoxy resin dispersion were discussed.The water-based epoxy resin dispersion was cured with a waterborne curing agent D-230,and the effects of the addition of different silica sol amounts on the hardness,flexibility,water resistance,acid and alkali resistance and corrosion resistance of the water-based epoxy resin coating were discussed.The thermal degradation curve showed that as the content of silica sol increased,the thermal degradation temperature of the modified waterborne epoxy resin dispersion gradually increased.The residual amount of waterborne epoxy resin increased from 8.96%to 17.19%at 500℃.

关 键 词：硅溶胶 水性环氧 固化 

分 类 号：TQ34[化学工程—化纤工业]