电镀金工艺的研究与应用现状  

Research and Application Status of Gold Plating

作　　者：刘建祥 安茂忠[2] 浦建堂 周磊 王晓 LLIU Jian-xiang;AN Mao-zhong;PU Jian-tang;ZHOU Lei;WANG Xiao(Shandong Xinhai Surface Technology Co.,Ltd.,Linyi 276034,China;School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]山东新海表面技术科技有限公司,山东临沂276034 [2]哈尔滨工业大学化工学院,黑龙江哈尔滨150001

出　　处：《材料保护》2020年第8期113-116,共4页Materials Protection

基　　金：2019山东省重点扶持区域引进急需紧缺人才项目:无氰电镀金新材料工艺开发及其应用资助。

摘　　要：简述了市场上已产业化应用的电镀金工艺,包括氰化物镀金、柠檬酸盐镀金、亚硫酸盐镀金、乙内酰脲镀金,分析了每种镀金工艺的金盐、配位剂、工艺参数等因素对镀层和镀液体系性能的影响。In this paper,the gold electroplating processes which had been industrialized on the market,including cyanide gold plating,citrate gold plating,sulfite gold plating and hydantoin compounds gold plating,were briefly summarized. Moreover,the effects of gold salt,complexant and gold plating process parameters of each process on the properties of plating coating and electrolyte system were analyzed.

关 键 词：电镀金 配位剂 镀层 镀液体系 

分 类 号：TQ153[化学工程—电化学工业]