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作 者:Choong-Jae Lee Kwang-Ho Jung Kyung Deuk Min Bum-Geun Park Seung-Boo Jung
机构地区:[1]School of Advanced Materials Science Engineering,Sungkyunkwan University,2066 Seobu-ro,Jangan-gu,Suwon-si,16419,Republic of Korea [2]Visual Display Business,Samsung Electronics Co.,Ltd.,129,Samsung-ro,Yeongtong-gu,Suwon-si,16677,Republic of Korea
出 处:《Journal of Materials Science & Technology》2020年第18期13-18,共6页材料科学技术(英文版)
基 金:supported by the Basic Science Research Program through the National Research Foundation of Korea(NRF)funded by the Ministry of Education(No.2019R1A6A1A03033215);supported by“Human Resources Program in Energy Technology”of the Korea Institute of Energy Technology Evaluation and Planning(KETEP),granted financial resource from the Ministry of Trade,Industry&Energy,Republic of Korea(No.20174030201800)。
摘 要:The study of photonic sintering has gained interest based on the advantages of fast processing at room temperature.However,printed electronics made from photonic sintering with an intensive pulsed light(IPL)energy source exhibit more mechanical instability than those made from conventional thermal sintering processes.To solve the mechanical instability problems,we fabricated Ag flake hybrid pastes with a variety of concentrations of Ag flake(0,25,50,75,and 100 wt.%).All of the screen-printed hybrid Ag circuits were fabricated on polyimide substrates and were sintered at 3.5 MW.Surface porosity was analyzed using the Brunauer-Emmett-Teller method.An IPC(Packaging Electronic Circuits)sliding test was performed to analyze the flexibility of the screen-printed Ag flake hybrid circuits.The adhesion strength of the hybrid circuits was evaluated with a roll-type 90°peel test.The hybrid Ag printed circuit showed improvements in both the flexibility and adhesion strength with the addition of Ag flake.
关 键 词:Low-temperature sintering FLEXIBILITY Flaky powders Adhesion strength Intensive pulsed light
分 类 号:TN41[电子电信—微电子学与固体电子学]
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