A unified model for determining fracture strain of metal films on flexible substrates  

作　　者：Xu-Ping Wu Xue-Mei Luo Hong-Lei Chen Ji-Peng Zou Guang-Ping Zhang 

机构地区：[1]Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China [2]School of Materials Science and Engineering,University of Science and Technology of Chin1,Shenyang 110016,China

出　　处：《Journal of Materials Science & Technology》2020年第19期87-94,共8页材料科学技术（英文版）

基　　金：the National Natural Science Foundation of China(Nos.51601198 and 51571199);the Foundation for Outstanding Young Scholar,Institute of Metal Research(IMR),China;the Natural Science Foundation of Liaoning Province of China(No.20180510025);the Foundation for Outstanding Young Scholar,the Shenyang National Laboratory for Materials Science,China(No.L2019F23)。

摘　　要：Failure strain determination of polymer-supported thin films is a key for the design of the flexible devices.A theoretical model R/R0=(L/L0)2(R,L are the electrical resistance and the length of the stretched film,respectively.R0,L0 are the corresponding initial values.)has been widely used to determine the fracture strain of thin films on flexible substrates.However,this equation loses its function in some special cases.Here,a simple and universal theoretical model was proposed to determine the fracture strain of metal thin films on flexible substrates in more generally situations.With this model,we investigated the thicknessdependent failure strains of Cu-5 at.%Al films with thickness of 10 nm,200 nm,1000 nm,and Ti films with thickness of 50 nm,100 nm,300 nm.This model was also employed to study the published data available.The results showed that the new model provided a fairly good prediction of the failure strains of different films.

关 键 词：Thin films FRACTURE Electrical resistance MICROSTRUCTURE Flexible substrate 

分 类 号：TB383.2[一般工业技术—材料科学与工程]