基于Mlodflow的打印机硒鼓后盖CAE模流分析  

CAE mould flow analysis of the printer cartridge back cover based on Moldflow

作　　者：尹小燕 苗健 谭安平 胡开元 YIN Xiao-yan;MIAO Jian;TAN An-ping;HU Kai-yuan

机构地区：[1]成都理工大学工程技术学院自动化工程系,四川乐山614000

出　　处：《模具技术》2020年第6期27-32,47,共7页Die and Mould Technology

摘　　要：以打印机硒鼓后盖为例,利用Moldflow软件对产品在注塑成型中的填充、冷却和保压对翘曲的影响进行分析,针对产生翘曲变形的3个因素(趋向效应、冷却不均、收缩不均)逐一进行优化。以默认工艺设置进行分析得到的翘曲变形量为1.615 mm。通过优化浇口、优化冷却系统、优化工艺参数,产品的翘曲变形量逐渐减少,最终翘曲变形量降低为0.809 mm,降低幅度约为50%,满足产品要求,优化成功。Taking the back cover of printer cartridge as an example,the influence of filling,cooling and pressure maintaining on warpage of products in injection moulding was analyzed by Moldflow software.Three factors(trend effect,uneven cooling and uneven shrinkage)influencing warping deformation were optimized one by one.Based on the analysis with default process settings,the warping deformation was 1.615 mm.By optimizing the gate,cooling system and process parameters,the warping deformation of products was gradually reduced.The final warping deformation was reduced to 0.809 mm with a reduction of about 50%.The optimization is successful to meet the product requirements.

关 键 词：打印机硒鼓后盖 翘曲 变形优化 模流分析 

分 类 号：TG241[金属学及工艺—铸造]