3种常用热界面材料的接触热阻压力实验研究  

Experimental study on thermal contact resistance of three common thermal interface materials

作　　者：谢明君[1] 张平[2] 蔡萌 边燕飞 XIE Mingjun;ZHANG Ping;CAI Meng;BIAN Yanfei(The fifty-fourth Research Institute,China Electronic Technology Group Corporation,Shijiazhuang 050081,China;School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄050081 [2]桂林电子科技大学机电工程学院,广西桂林541004

出　　处：《桂林电子科技大学学报》2020年第4期362-365,共4页Journal of Guilin University of Electronic Technology

基　　金：中国电子科技集团公司第五十四研究所发展基金(SXX19137X016)。

摘　　要：为了更好降低固-固界面接触热阻,研究了导热硅脂、导热橡胶垫、铟片这3种工程上常用的热界面材料随加载压力变化对固-固界面接触热阻的影响。稳态热流法实验结果表明,30 psi的压力为工程建议选取压力值。如当压力小于30 psi时,导热硅脂和导热橡胶垫对接触热阻的影响随压力变化显著;当压力大于30 psi时,导热硅脂和导热橡胶垫对接触热阻的影响随压力变化则不明显;导热橡胶垫的厚度随压力变化对接触热阻的影响较大,铟片随压力变化对接触热阻的影响是近似呈线性变化。In the field of electronics thermal management,the most important method to control the temperature rise of electronic devices is by use the thermal interface materials to reduce the thermal contact resistance.In this paper,the effects of thermal conductive silicone grease,thermal conductive rubber pad and indium sheet on the thermal contact resistance of solid-solid interface were studied by steady-state heat flow method.The experimental results show that the pressure of 30 psi is recommended for engineering.For example,when the pressure is less than 30 psi,the influence of thermal conductive silicone grease and thermal rubber pad on the thermal contact resistance changes significantly with the pressure.When the pressure is greater than 30 psi,the influence of thermal conductive silicone grease and thermal conductive rubber pad on thermal contact resistance is not obvious.The thickness of thermal conductive rubber pad changes with pressure has a greater impact on the contact thermal resistance.The influence of indium plate on thermal contact resistance is approximately changes linearly with the pressure.

关 键 词：一维稳态热流法 接触热阻 热界面材料 

分 类 号：TB131[理学—物理]