高光谱遥感高速成像电路电磁兼容设计  

Electromagnetic compatibility design of hyperspectral remote sensing high-speed imaging circuit

作　　者：刘永征[1] 刘学斌[1] 刘文龙 张昕 陈小来[1] LIU Yongzheng;LIU Xuebin;LIU Wenlong;ZHANG Xin;CHEN Xiaolai(Xi’an Institute of Optics and Precision Mechanics of Chinese Academy of Sciences, Xi’an 710119, China)

机构地区：[1]中国科学院西安光学精密机械研究所,陕西西安710119

出　　处：《系统工程与电子技术》2021年第1期26-32,共7页Systems Engineering and Electronics

摘　　要：在高光谱遥感成像领域,成像载荷在高空间分辨率、高光谱分辨率及大幅宽等指标方面需求不断提升,为解决星载高光谱成像高速电子学愈演愈烈的电磁干扰(electromagnetic interference,EMI)问题,提出了增强星载高光谱成像仪电磁兼容(electromagnetic compatibility,EMC)能力的针对性设计方法,并通过在某系列高分辨率高光谱成像仪载荷上的具体实施,验证了EMC针对性设计的有效性。为寻求高光谱成像仪EMI设计的理论方法及技术实现手段进行了有益探索,为其他遥感用星载高速成像载荷设计提供了有益借鉴。In the field of hyperspectral remote sensing imaging,the demand of indicators for hyperspectral remote resolution,hyperspectral resolution and large width of imaging loads are improved.To solve the problem that the electromagnetic interference(EMI)of the high-speed electronics of spaceborne hyperspectral imaging is becoming more and more intensive,the target design method to enhance the electromagnetic compatibility(EMC)capability of the spaceborne hyperspectral imager is proposed,and the implementation of the load on a specific series of high resolution hyperspectral imager verified the effectiveness of the targeted design.In order to seek the theoretical methods and technical implementation methods of EMI design for high-speed hyperspectral imagers,the useful explorations is made to provide a useful reference for the design of other spaceborne high-speed imaging loads for remote sensing.

关 键 词：电磁兼容 电磁兼容设计 高光谱成像仪 高速成像电路 

分 类 号：TP732[自动化与计算机技术—检测技术与自动化装置]