低渗油高导热硅脂界面材料的制备及其性能  被引量:9

Preparation and Characterization of Thermal Conductive Grease with High Thermal Conductivity and Low Migration

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作  者:陈冉冉 任晓雯 孙敬文 王帆[1] 朱亚平 齐会民[1] CHEN Ranran;REN Xiaowen;SUN Jingwen;WANG Fan;ZHU Yaping;QI Huimin(Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education,School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China;Shanghai Institute of Satellite Equipment,Shanghai 200240,China)

机构地区:[1]特种功能高分子材料及相关技术教育部重点实验室,华东理工大学材料科学与工程学院,上海200237 [2]上海卫星装备研究所,上海200240

出  处:《材料科学与工程学报》2020年第6期954-960,983,共8页Journal of Materials Science and Engineering

基  金:中央高校基本科研业务费专项资金资助项目(50321041917001)。

摘  要:针对航天器界面材料对导热率和渗油特性的要求,以聚甲基苯基硅氧烷(PMPS)、羟基封端聚二甲基硅氧烷(PDMS)为基体,通过填料堆积密度设计与粒径选择、不同填料的协同作用、填料的表面改性,以及添加纳米粒子,制得了高导热低渗油导热硅脂(TCG),其导热系数达5.7 W/(m·K),在测试条件下,基本无渗油现象。研究表明,通过对多种粒径球状Al粉进行粒径复配,可使填料达到密堆积结构;再搭配少量Ag粉,发挥不同形貌填料的协同作用,构建更有效的导热通路;对导热填料进行表面改性,可改善其与基体的相容性,进一步提高填料的填充量,从而改善TCG的导热性能。采用PDMS为基体,发挥其氢键作用以及少量纳米颗粒添加剂的协同作用,可降低TCG的渗油率。在模拟使用环境下,低渗油高导热TCG具有优良的散热效果,加热元件温度从39.4℃降低到37.1℃,并在高低温热循环条件下,不开裂,不渗油。Aiming at the requirements of thermal conductivity and oil migration of spacecraft interfacial material,thermal conductive grease(TCG)with high thermal conductivity and low migration was prepared with methylphenyl silicone oil and hydroxyl silicone oil as matrix.Through packing density design,particle size selection,synergistic effect of different fillers,surface modification of fillers and addition of nanoparticles,thermal conductivity of TCG can reach 5.7 W/(m·K)with almost no oil migration under the test condition.This result had shown that the spherical aluminum powders with different particle sizes achieved dense packing structure by a proper particle arrangement.With small amount of silver powder,a more effective heat conduction path was formed due to the synergistic effect of fillers with different morphologies.Besides,the surface modification had improved the compatibility of the fillers with the matrix to increase the filling amount,thus improving the thermal conductivity of the TCG.And the oil migration of the TCG was significantly reduced due to the hydrogen bonding of the hydroxyl silicone oil and synergy with a small amount of nano-additives.Under the simulated environment test,TCG had excellent heat dissipation effect,and the temperature of heating element was reduced from 39.4℃to 37.1℃.And under the thermal cycling test,TCG achieved no cracking and no oil migration.

关 键 词:导热硅脂 界面材料 导热性能 低渗油 

分 类 号:TB333[一般工业技术—材料科学与工程]

 

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