微波板式PECVD设备多晶硅片表面镀膜均匀性影响因素的研究  

RESEARCH ON INFLUENCING FACTORS OF COATING UNIFORMITY ON POLYCRYSTALLINE SILLICON WAFER SURFACE OF MICROWAVE PLATE PECVD EQUIPMENT

作　　者：王贵梅 刘苗 朱少杰 赵环 李影影 Wang Guimei;Liu Miao;Zhu Shaojie;Zhao Huan;Li Yingying(JingAo Solar Co.,Ltd.,XingTai 055550,China)

机构地区：[1]晶澳太阳能有限公司,邢台055550

出　　处：《太阳能》2020年第12期56-61,共6页Solar Energy

摘　　要：由于多晶硅片表面在不同晶粒之间的晶格取向、绒面特性,反射率等方面都存在较大差别,因此在多晶硅片表面制备的SiNx膜的均匀性较差。研究微波板式PECVD设备相关配件对其在多晶硅片表面镀膜时膜层均匀性的影响。结果显示,石英管、耐高温胶带厂家的差异,气路的气孔个数差异,加热板、导波器的完好程度差异均会对微波板式PECVD设备在多晶硅片表面镀膜时的均匀性产生较大影响。The crystal lattice orientation,texture characteristics and reflectivity of the polycrystalline silicon wafers are quite different,resulting in poor uniformity of the SiNx film deposited on it.This paper studies the influence of equipment spare parts of microwave plate PECVD equipment on the coating uniformity.It is found that the different quartz tube and high temperature resistant tape manufacturers,the difference in the number of spiracle,the still-well degree of heating plate and wave guide equipment have a greater impact on the uniformity of coating.

关 键 词：多晶硅片 SiNx膜 微波板式PECVD设备 均匀性 

分 类 号：TK514[动力工程及工程热物理—热能工程]