Cu中间层超声辅助瞬间液相扩散连接MB8镁合金机制研究  

Study on mechanism of ultrasonic assisted transient liquid phase bonding of MB8 magnesium alloy with Cu interlayer

作　　者：吴志远 崔壮 周韬帅 彭子龙 李一楠 WU Zhi-yuan;CUI Zhuang;ZHOU Tao-shuai;PENG Zi-long;LI Yi-nan(School of Mechanical and Automotive Engineering,Qingdao University of Technology,Qingdao 266525,China)

机构地区：[1]青岛理工大学机械与汽车工程学院,青岛266525

出　　处：《青岛理工大学学报》2020年第6期96-101,共6页Journal of Qingdao University of Technology

基　　金：国家自然科学基金资助项目(51871128,51875300);山东省自然科学基金资助项目(ZR2017MEE012,ZR2018MEE017);山东省重点研发计划项目(2018GGX103036)。

摘　　要：为了研究Cu箔为中间层连接镁合金的接头显微组织及力学性能在超声作用下的规律,在500℃温度下使用超声辅助瞬间液相扩散连接(U-TLP)MB8镁合金.结果表明:在超声作用时间为1 s时,母材表面氧化膜破裂,与Cu箔直接接触发生共晶反应,在Cu表面生成一层脆性金属间化合物Mg2Cu;随着超声时间延长,Cu箔逐渐被溶解消耗,α-Mg+Mg2Cu共晶液相增加,然后在超声杆预压力与声流作用下被挤出,最终在超声作用30 s时形成部分区域以α-Mg(Cu)为主的接头,此时的剪切强度为68.9 MPa.In order to study the microstructure and mechanical properties of Cu foil interlayer joint of magnesium alloy under ultrasonic action,in this paper,MB8 magnesium alloy was connected by ultrasonic assisted transient liquid phase bonding(U-TLP)at 500℃.The results show that the eutectic reaction occurs when the ultrasonic action time was 1 s and the oxide film on the surface of the parent material breaks in direct contact with the Cu foil,and a brittle intermetallic compound Mg2Cu is formed on the surface of Cu.With the extension of ultrasonic time,Cu is gradually dissolved and consumed,and the eutectic liquid phase ofα-Mg+Mg2Cu increases,and then is extruded under the action of pre-pressure and acoustic flow of ultrasonic rod.In the end,the joint dominated byα-Mg(Cu)in some areas is formed at 30 s under ultrasonic action,at which time the shear strength is 68.9 MPa.

关 键 词：显微组织 力学性能 超声辅助瞬间液相扩散连接 MB8镁合金 氧化膜 

分 类 号：TG456.9[金属学及工艺—焊接]