Thermal Properties of Ni–Cr–Si–B–Fe Based Interlayer Material and Its Application in TLP Bonding of IN 718 Superalloy  

作　　者：U.K.Tarai P.S.Robi Sukhomay Pal 

机构地区：[1]Department of Mechanical Engineering,IIT Guwahati,Guwahati 781039,India

出　　处：《Acta Metallurgica Sinica(English Letters)》2020年第12期1666-1680,共15页金属学报（英文版）

基　　金：financially supported by the Department of Mechanical engineering and Central Instruments Facility of Indian Institute of Technology Guwahati,India-781039。

摘　　要：A new Ni–Cr–Si–B–Fe fi ller material is prepared for transient liquid-phase(TLP)bonding of Inconel 718 superalloy by mechanical alloying technique.The melting temperature range of the fi ller material and its activation energy of melting are determined by diff erential scanning calorimetry technique.The activation energy and melting temperature of the alloy powder decrease with increasing milling time.Inconel 718 alloy was joined via TLP by using the newly developed fi ller material.The eff ect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated.Three distinct microstructural regions were observed in the bonding area:isothermal solidifi cation zone consisting of a single-phase solid solution,diff usion aff ected zone consisting of extensive diff usion-induced precipitates of metallic boride,and unaff ected base material.The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.

关 键 词：Transient liquid-phase(TLP)bonding Kissinger plot Mechanical alloying Inconel 718 

分 类 号：TG132.3[一般工业技术—材料科学与工程]