含微米银颗粒OLED封装胶中的湿气扩散研究  

Moisture diffusion in OLED encapsulation adhesive with silver fillers

作　　者：谈隆旺 张燕[1] 印航 刘建影[1,2] TAN Longwang;ZHANG Yan;YIN Hang;LIU Johan(School of Mechatronic Engineering and Automation,Shanghai University,Shanghai 200444,China;Department of Microtechnology and Nanoscience,Chalmers University of Technology,Gothenburg SE41296,Sweden)

机构地区：[1]上海大学机电工程与自动化学院,上海200444 [2]查尔姆斯理工大学微技术与纳米科学系,瑞典哥德堡SE41296

出　　处：《电子元件与材料》2020年第12期101-105,共5页Electronic Components And Materials

基　　金：国家自然科学基金(11672171)。

摘　　要：有机电致发光显示器(Organic Light-Emitting Diode,OLED)具有优异的显示特性,但湿气对其寿命的影响十分明显。添加微米银颗粒的OLED框封装胶具有较好阻湿效果。实验测试了封装OLED器件性能,继而建立有限元模型分析了含微米银颗粒复合材料对降低湿气扩散的作用。有限元模拟中,首先建立单胞模型得到复合材料有效扩散系数,并研究了不同银颗粒体积分数时的湿气扩散性能。进而根据OLED封装结构建立整体模型,结合单胞模型得到的有效扩散系数计算湿气在OLED封装胶中的扩散过程。实验测量表明,框胶封装可以有效延缓OLED器件的性能下降。计算结果表明,增加银颗粒含量可以延缓湿气在封装材料中的扩散,从而延长OLED器件寿命。Organic light-emitting diode(OLED)devices have excellent display characteristics,while their performances are sensitive to the moisture.The moisture diffusion in the OLED encapsulation adhesive can be improved by introducing silver particle fillers.The performance of the OLED devices with different package modes was measured by experiments,and finite element models were then established to analyze the effect of silver particle filling on the moisture diffusion.In this model,a cell model was firstly established to obtain the effective moisture diffusion coefficient of the composite so that the moisture diffusion in the composites can be quantitatively analyzed for different Ag particle contents.After that,a comprehensive model was established by considering the OLED packaging structure and the effective moisture diffusion coefficient from the cell model.Finally,numerical simulations were carried out to investigate the moisture diffusion mechanism in the OLED encapsulation.The experimental measurements show that the adhesive encapsulation of the OLED device can remarkably mitigate the performances degradation.The simulation results indicate that the introduction of Ag particles can delay the moisture diffusion in the adhesive composite and consequently increase the device lifetime.

关 键 词：OLED封装 湿气扩散 有效扩散系数 单胞模型 可靠性 

分 类 号：TB333[一般工业技术—材料科学与工程]