退火温度对铁∑5〈001〉对称倾斜晶界迁移行为影响的分子动力学模拟研究  

Study on Effect of Annealing Temperature on Migration Behavior of Fe ∑5〈001〉Symmetrical Tilt Grain Boundary by Molecular Dynamics Simulation

作　　者：姜丽红[1,2] 曾丽君 杨亮 郭正华[2] JIANG Lihong;ZENG Lijun;YANG Liang;GUO Zhenghua(Key Laboratory for Microstructural Control of Metallic Materials of Jiangxi Province,Nanchang Hangkong University,Nanchang 330063,China;School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]南昌航空大学江西省金属材料微结构调控重点实验室,江西南昌330063 [2]南昌航空大学航空制造工程学院,江西南昌330063

出　　处：《热加工工艺》2020年第24期105-108,共4页Hot Working Technology

基　　金：江西省教育厅青年基金资助项目(GJJ190527);江西省金属材料微结构调控重点实验室开放基金项目(EJ201903433);江西省重大科技研发专项项目(20194ABC28001)。

摘　　要：为探究较少被关注的体心立方金属内晶界的迁移行为,以铁∑5 36.9°〈001〉对称倾斜晶界为研究对象,利用分子动力学模拟方法在300~1300 K范围内探究了退火温度对其晶界迁移的影响。结果表明,铁∑5晶界的迁移行为遵循热激活机制,只有当温度不低于700 K时才沿晶界面法向发生迁移,且温度越高晶界迁移越快。晶界在沿晶界面法向发生迁移的同时,还会在晶界面内发生剪切运动。剪切位移在700 K时达到最大,当温度继续升高时剪切位移急剧下降。整体而言,退火温度对晶界面法向迁移和剪切运动明显会产生不同的影响,对剪切运动的影响要相对更为复杂。In order to investigate the migration behaviors of grain boundaries in body-centered cubic metals, taking the Fe∑ 5 36.9°〈001〉symmetrical tilt grain boundary as a example, the effects of annealing temperature on grain boundary migration were investigated in the range of 300-1300 K using molecular dynamics simulation. The results show that the migration behavior of Fe ∑ 5 grain boundaries follows the thermal activation mechanism. The normal migration along the grain boundary surface occurs only when the temperature is not lower than that of 700 K, and the higher the temperature, the faster the grain boundary migration. The grain boundary migrates along the normal direction of the crystal interface, and the shear motion occurs at the crystal interface. At 700 K, the shear displacement reaches the maximum, and the shear displacement decreases sharply when t he temperature continues to rise. As a whole, the annealing temperature has different effects on the normal migration and shear motion of grain boundary surface, and the effect on the shear motion is more complex.

关 键 词：退火温度 分子动力学 体心立方金属 晶界迁移 

分 类 号：TG174.44[金属学及工艺—金属表面处理] TG439.4[金属学及工艺—金属学]