Crystallographic orientation effect on cutting-based single atomic layer removal  被引量:1

在线阅读下载全文

作  者:Wenkun XIE Fengzhou FANG 

机构地区:[1]Centre of Micro/Nano Manufacturing Technology(MNMT-Dublin),University College Dublin,Dublin 4,Ireland [2]State Key Laboratory of Precision Measuring Technology and Instruments,Centre of Micro/Nano Manufacturing Technology(MNMT),Tianjin University,Tianjin 300072,China

出  处:《Frontiers of Mechanical Engineering》2020年第4期631-644,共14页机械工程前沿(英文版)

基  金:The authors would like to thank the finical support from the Science Foundation Ireland(Grant No.15/RP/B3208);the‘111’Project by the State Administration of Foreign Experts Affairs and the Ministry of Education of China(Grant No.B07014).

摘  要:The ever-increasing requirements for the scalable manufacturing of atomic-scale devices emphasize the significance of developing atomic-scale manufacturing technology. The mechanism of a single atomic layer removal in cutting is the key basic theoretical foundation for atomic-scale mechanical cutting. Material anisotropy is among the key decisive factors that could not be neglected in cutting at such a scale. In the present study, the crystallographic orientation effect on the cutting-based single atomic layer removal of monocrystalline copper is investigated by molecular dynamics simulation. When undeformed chip thickness is in the atomic scale, two kinds of single atomic layer removal mechanisms exist in cutting-based single atomic layer removal, namely, dislocation motion and extrusion, due to the differing atomic structures on different crystallographic planes. On close-packed crystallographic plane, the material removal is dominated by the shear stress-driven dislocation motion, whereas on non-close packed crystallographic planes, extrusion-dominated material removal dominates. To obtain an atomic, defect-free processed surface, the cutting needs to be conducted on the close-packed crystallographic planes of monocrystalline copper.

关 键 词:ACSM single atomic layer removal mecha-nism crystallographic orientation effect mechanical cutting Manufacturing III 

分 类 号:TG506[金属学及工艺—金属切削加工及机床]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象