正交试验法优化Ni-P-Cu-PTFE复合化学镀工艺  

Optimization Process for Electroless Composite Plating of Ni-P-Cu-PTFE by Orthogonal Test

作　　者：马永纯[1] 贾树勇 曾宪光 黎安邱 MA Yongchun;JIA Shuyong;ZENG Xianguang;LI Anqiu(Jilin Normal University Liaoyuan Branch,Liaoyuan 136200,China;Liten Opto(Changzhou)Co.Ltd,Changzhou 213000,China;不详;Material Corrosion and Protection Key Laboratory of Sichuan Province,Zigong 643000,China)

机构地区：[1]吉林师范大学辽源分院,吉林辽源136200 [2]光宝光电(常州)有限公司,江苏常州213000 [3]四川轻化工大学材料科学与工程学院,四川自贡643000 [4]材料腐蚀与防护四川省重点实验室,四川自贡643000

出　　处：《电镀与精饰》2020年第12期15-19,共5页Plating & Finishing

基　　金：四川省青年科技创新研究团队项目(2016TD0024)。

摘　　要：以Q235碳钢为基体采用化学镀方法制备了Ni-P-Cu-PTFE复合镀层,以沉积速率为考察指标采用正交试验法优化了Ni-P-Cu-PTFE配方及工艺条件,并研究了镀层的形貌、硬度、耐蚀性等。结果表明,最佳的镀液配方及工艺条件为硫酸镍30.0 g/L、硫酸铜0.8 g/L、氟化氢铵14.0g/L、次亚磷酸钠30.0 g/L、十二烷基硫酸钠0.04 g/L、硫脲0.004 g/L、柠檬酸三钠12.0 g/L、聚四氟乙烯12.0 mL/L,镀液pH值为4.5,化学镀温度80℃,施镀时间2 h。在该条件下,镀层沉积速率可达178.64 g/(m2·h),镀层硬度可达207.93 HV,获得的镀层表面致密平整,孔隙率较小,具有较好的耐蚀性。The Ni-P-Cu-PTFE composite coating was prepared by electroless plating on the Q235 carbon steel substrate,the formula and process conditions were optimized by orthogonal experiment with the de⁃position rate as the indicator,in addition,the morphology,hardness and corrosion resistance of the Ni-P-Cu-PTFE coating were studied.The results showed that the optimum formulation and process condi⁃tions were required as follows:the concentration of NiSO4·6H2O,CuSO4·5H2O,NaH2PO2·H2O,NH4HF2,Na3C6H5O7·2H2O,C12H25NaO4S,CN2H4S,polytetrafluoroethylene were 30.0 g/L,0.8 g/L,30.0 g/L,14.0 g/L,12.0 g/L,0.04 g/L,0.004 g/L,12.0 mL/L respectively,the bath pH value of 4.5,the temperature of 80℃,and the plating time of 2 h.Under this condition,the deposition rate of the coating could reach 178.64 g(/m2·h),and the hardness could reach 207.93 HV.The obtained coating had a com⁃pact and flat surface,small porosity,and strong corrosion resistance.

关 键 词：复合化学镀 Ni-P-Cu-PTFE 正交试验 工艺优化 

分 类 号：TQ153.12[化学工程—电化学工业]