大尺寸PGA封装器件机械试验装夹方法研究  

Research on the Clamping Method of Mechanical Test for Large-sized Devices with PGA Package

作　　者：朱朝轩 陈亮[1] 但雅 ZHU Chao-xuan;CHEN Liang;DAN Ya(The 24th Research Institute of CETC,Chongqing 40060;The 26th Research Institute of CETC,Chongqing 40060)

机构地区：[1]中国电子科技集团公司第二十四研究所,重庆400060 [2]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《环境技术》2020年第6期211-215,220,共6页Environmental Technology

基　　金：模拟集成电路国家重点实验室基金资助项目(61428020505)。

摘　　要：针对光电微系统等新型大尺寸PGA封装器件的多方向离心、振动、冲击等机械试验要求,导致现有装夹方法不再适用的问题,本文提出了以大小相等的力同时挤压这类器件四个侧面的装夹方式以完成固定,实现对这类器件在多方向离心、振动、冲击等机械试验中的装夹,且基于该方法设计的夹具,可实现对不同机械试验的通用。The mechanical test requirements of large-size PGA packaging devices,such as multidirectional centrifugation,vibration and impact,become increasingly complex,which caused existing clamping methods are inapplicable.A new clamping method was proposed that four sides of device are extruded simultaneously with each of equal force to fixing the device.Thus device could be clamped completely in the multi-directional centrifugal,vibration,impact or other complicated mechanical tests.Additionally,fixtures based on the clamping method could be useful in different mechanical tests.

关 键 词：大尺寸PGA封装 光电微系统 装夹方法 通用夹具 

分 类 号：TN605[电子电信—电路与系统]