TIG电弧作用下Ag-Cu-Ti钎料在C/C复合材料上的润湿性分析  

Wettability of Ag-Cu-Ti filler metal on C/C composites under TIG arc

作　　者：于江[1,2] 刘浩然 赵帅彤泽 杨笑 张文杰 YU Jiang;LIU Haoran;ZHAO Shuaitongze;YANG Xiao;ZHANG Wenjie(Harbin Institute of Technology,State Key Laboratory of Advanced Welding and Joining,Harbin,150001,China;Shandong Provincial Key Laboratory of Special Welding Technology,Weihai,264209,China;Hanhong College of Southwest University,Chongqing,400700,China;Shenyang Aerospace University,Shenyang,110136,China;FAW Car Co.,Ltd,Changchun,130012,China;Weihai Donghai Shipyard CO.,LTD,Weihai,264209,China)

机构地区：[1]哈尔滨工业大学,先进焊接与连接国家重点实验室,哈尔滨150001 [2]山东船舶技术研究院,威海264209 [3]西南大学含弘学院,重庆400700 [4]沈阳航空航天大学,沈阳110136 [5]一汽轿车股份有限公司,长春130012 [6]威海东海船舶修造有限公司,威海264209

出　　处：《焊接学报》2020年第9期69-73,I0004,I0005,共7页Transactions of The China Welding Institution

基　　金：山东省重大科技创新工程项目(2019JZZY010366);烟台市重点研发计划(2019ZDCX006);威海市产业技术研究院专项扶贫资金支持项目(202001PTXM08).

摘　　要：通过TIG电弧直接加热方式实现Ag-Cu-Ti钎料在C/C复合材料上的润湿,观察不同保温时间下润湿钎料宏观形貌,并利用SEM和EDS研究接头微观组织和元素分布.结果表明,在一定保温时间下钎料发生软化,当保温时间为60 min时,钎料在C/C复合材料上润湿效果最好,TiC反应层分布最均匀致密,厚度约为1.3μm,扩散层厚度最大为5.5μm.在向反应界面接近的过程中,钎料中Cu和Ag的含量和保持不变,并有AgTi/CuTi3/Cu4Ti3等脆性化合物的生成.此外,Ti元素在近界面处发生聚集,在聚集区有Ti2Cu生成.The Ag-Cu-Ti filler metal was wetted on C/C composites by the TIG arc directly.The macroscopic features of the wetting filler metal under different holding times were observed.Besides,the microstructure and element distribution of the joints was analyzed by SEM and EDS,respectively.The experimental results showed that the filler metal can soften under certain holding time.When the holding time was 60 min,the wetting effect of filler metal on C/C composites was the best.The distribution of the TiC reaction layer was the most uniform and dense with a thickness of 1.3μm.Besides,the maximum thickness of the diffusion layer was 5.5μm.When the content of copper and silver in the filler metal approaching to the reaction interface remained the same,there were brittle compounds such as AgTi/CuTi3/Cu4Ti3.Meanwhile,Ti elements gathered near the interface and Ti2Cu was produced in the aggregation area.

关 键 词：TIG电弧 AG-CU-TI钎料 C/C复合材料 润湿 

分 类 号：TG454[金属学及工艺—焊接]