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作 者:苟辉 邢慧超 马亚伟 于梅 Gou Hui;Xing Huichao;Ma Yawei;Yu Mei
机构地区:[1]中国航空工业集团公司西安航空计算技术研究所,陕西西安710068
出 处:《印制电路信息》2020年第12期24-29,共6页Printed Circuit Information
摘 要:针对等长刚挠结合板因受力不均而导致产生挠性部分折断现象,文章提出了一种不等长(书本型)刚挠板加工工艺,并以我司一款不等长刚挠板为例,详细介绍加工过程中的重难点技术。通过实验对介质层厚度、内层蚀刻参数以及不等长刚挠板的压合工艺进行适应性调整与改进,生产出符合要求的不等长刚挠板,为不等长刚挠结合板的加工工艺提供技术支持。To solve the problem that the flexible part of the rigid-flex board of equal length was broken due to the uneven force,a unequal-length(bookbinder)rigid-flex board processing technology was proposed,and the paper introduced in detail the important and difficult technologies in the processing process by taking a rigid-flex board of the company as an example.The thickness of the dielectric layer,the etching parameters of the inner layer and the pressing process of the unequal-length rigid-flex board was adjusted and improved through experiments.And the unequal-length rigid-flex boards that meet the requirements were produced with the technical support of the processing technology of unequal length rigid-flex board.
关 键 词:不等长刚挠结合板 介质层厚度 内层蚀刻参数 压合工艺
分 类 号:TN41[电子电信—微电子学与固体电子学]
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