大功率电力电子器件散热研究综述  

Review on Heat Dissipation of High Power Electronic Devices

作　　者：李广义[1] 张俊洪[1] 高键鑫[1] LI Guangyi;ZHANG Junhong;GAO Jianxin(Naval University of Engineering, Wuhan 430033, China)

机构地区：[1]海军工程大学,武汉430033

出　　处：《兵器装备工程学报》2020年第11期8-14,共7页Journal of Ordnance Equipment Engineering

基　　金：国家自然科学基金项目(51807197)。

摘　　要：针对现阶段制约电力电子技术发展的散热问题,以温度对电力电子器件的影响、电力电子设备热设计特点、常见散热技术、散热系统优化研究和新材料在电力电子散热研究中的应用这五方面为切入点,论述了大功率电力电子器件散热研究现状,分析了进一步的发展方向;发现针对电力电子器件散热技术的基础理论研究成果较为丰富,并且在散热器的几何和结构优化及散热系统风道设计等方面的研究也已十分深入,不少论文针对性的提出了多种优化结构及优化算法;在未来电力电子器件的散热器件材料研究中新型散热材料和热界面材料的研发仍然是研究重点;并且新散热技术的研究也需进一步深入。In view of the heat dissipation problems that restrict the development of power electronic technology at present,the research status and the further development directions of high power electronic devices heat dissipation technology was summarized based on five aspects:the impact of temperature,thermal design characteristics,common heat dissipation technology,heat dissipation system optimization research and the application of new materials.Analysis found that there are abundant achievements in basic theory research on power electronic device heat dissipation technology,in addition,the geometric and structure optimization of heat sink and the design of air ducts in cooling systems have been studied in depth,and various optimization structures and optimization algorithms have been proposed.In the future,the research and application of new heat dissipation materials and thermal interface materials are still the focus of research,and the research of new heat dissipation technology also needs to be further in-depth.

关 键 词：大功率电力电子器件 热设计 散热 高功率密度 

分 类 号：TN305[电子电信—物理电子学]