5G通信对PCB基材的要求  

Requirements of base material of PCB for 5G communication

作　　者：林金堵 Lin Jindu(不详)

机构地区：[1]不详

出　　处：《印制电路信息》2021年第1期7-12,共6页Printed Circuit Information

摘　　要：概述了5G通信的频段范围和概念,5G通信将带来传输速度更快、延时更小和更大传输量等。5G通信产品对PCB用基板材料有更高的要求,特别是介电损耗、介电常数和导热等方面要有质的提升,这对基板材料的发展无疑是个挑战又是机遇。The frequency range and concept of 5G communication are summarized.5G communication will bring faster transmission speed,smaller delay and larger transmission volume.5G communication products have higher requirements for PCB base materials,especially the improvement of dielectric loss,dielectric constant and thermal conductivity,which is a challenge and an opportunity for the development of base materials.

关 键 词：5G通信 概念和优势 基材 

分 类 号：TN41[电子电信—微电子学与固体电子学]