光模块PCB技术和热管理探究  

Research on optical module PCB technology and thermal management

作　　者：李清春 胡玉春 邱小华 Li Qingchun;Hu Yuchun;Qiu Xiaohua(不详)

机构地区：[1]惠州中京电子科技有限公司,广东惠州516029

出　　处：《印制电路信息》2021年第1期45-51,共7页Printed Circuit Information

摘　　要：光模块作为光纤与电缆传输之间的信号转换媒介,在实现高速信号远距离、高保真、低损耗传输上,起到不可或缺的作用。随着5G基站和大数据中心的大规模建设,以及其他网络通信产品的增加,催生了对高速光模块的巨大需求。另一方面,伴随着PCB材料、封装技术以及芯片设计制造技术的发展,光模块向着小型化,低成本、低功耗、高速率、长距离,热插拔方向发展。本文主要探讨光模块PCB相关设计、制程、表面处理以及热管理等问题。As a conversion medium between optical fiber and copper cable transmission,optical module plays an indispensable role in realizing long-distance,high fidelity and low loss high-speed signal transmission.large-scale construction of 5G base station and big data center,as well as the increase of other network communication products,demand large number of high-speed optical modules.On the other hand,with the development of PCB materials,packaging technology and chip design and manufacturing,optical modules are developing towards miniaturization,low cost,low power consumption,high speed,long distance and hot pluggable.This paper mainly discusses the design,process,surface treatment and heat management of optical PCB.

关 键 词：盲孔跳孔 埋铜块 铜浆塞孔 通孔填孔 金手指 

分 类 号：TN41[电子电信—微电子学与固体电子学]