钼合金热等静压扩散连接技术研究进展  

Research progress on HIP diffusion bonding of molybdenum alloys

作　　者：王铁军[1,2,3] 张龙戈[1,2,3] 车洪艳 杜亚雄 李林[4] WANG Tiejun;ZHANG Longge;CHE Hongyan;DU Yaxiong;LI Lin(Central Iron and Steel Research Institute,Beijing 100081,China;Advanced Technology and Materials Limited Company,Beijing 100081,China;Engineering and Technology Research Center of Hot Isostatic Pressing,Baoding 072750,China;Beijing System Design Institute of Electro-mechanic Engineering,Beijing 100854,China)

机构地区：[1]钢铁研究总院,北京100081 [2]安泰科技股份有限公司,北京100081 [3]河北省热等静压工程技术研究中心,河北保定072750 [4]北京机电工程总体设计部,北京100854

出　　处：《粉末冶金工业》2020年第6期80-84,共5页Powder Metallurgy Industry

摘　　要：本文简要分析了扩散连接的机制和热等静压工艺的特点,从中间层体系及热等静压工艺参数的选择等方面介绍了热等静压扩散连接技术在钼合金上的应用。最后对目前的工艺进展进行了总结,对未来的发展趋势进行了展望。In this paper,the mechanism of diffusion bonding and the process characteristics of HIP are briefly analyzed.The application of diffusion bonding technology in molybdenum alloys is introduced from the aspects of the selection of intermediate layer system and process parameters.Finally,the currently process progress is summarized and the future development trend is prospected.

关 键 词：扩散连接 热等静压 钼合金 

分 类 号：TG453.9[金属学及工艺—焊接]