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作 者:林志树 黄辉 LIN Zhishu;HUANG Hui(School of Mechanical and Automotive Engineering,Xiamen University of Technology,Xiamen,Fujian,361024;Institute of Manufacturing Engineering,Huaqiao University,Xiamen,Fujian,361021)
机构地区:[1]厦门理工学院机械与汽车工程学院,厦门361024 [2]华侨大学制造工程研究院,厦门361021
出 处:《中国机械工程》2021年第2期132-140,共9页China Mechanical Engineering
基 金:国家自然科学基金(51375179,U1805251);福建省高校产学研项目(2017H6014);教育部创新团队滚动计划(IRT_17R41)。
摘 要:利用多线往复摇摆线锯对不同形状的水晶玻璃进行切割试验,测量了不同线速度、不同进给速比条件下的切片表面粗糙度,研究了加工工艺参数对切片表面粗糙度的影响规律。试验结果表明,摇摆运动会有效地降低切片的整体表面粗糙度,线速度的提高有利于减小切片整体表面粗糙度,进给速比的改变对加工表面不同位置的粗糙度影响较大。单位长度材料去除量与切片表面粗糙度之间有较好的对应关系,减小切割过程中单位长度材料去除量可有效地降低切片的表面粗糙度。利用单位长度材料去除量可有效归整多线往复摇摆线锯加工运动中的多个调控参量。Slicing experiments of crystal glass with different shapes were carried out in multi-wire saw with reciprocating and rocking.Surface roughness of the slicing crystal glass wafers were measured with various wire speeds and feed speed ratios,and the influences of processing parameters on the surface roughness of the slicing wafers were studied.The experimental results show that rocking motion effectively reduces overall surface roughness of the slicing wafers,the increase of wire speed reduces overall surface roughness,feed speed ratio has a greater impact on the roughness of slicing surfaces on different locations.The material removal per unit length of wires has a good correspondence with the surface roughness of the slicing wafers,the decrease of the material removal per unit length of wire may effectively reduce the surface roughness of the slicing wafers.Multiple control parameters in slicing movement in multi-wire saws with reciprocating and rocking may be normalized to the indicator of material removal per unit length of wires.
分 类 号:TH161[机械工程—机械制造及自动化]
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