阳离子型延迟固化环氧胶粘剂的性能研究与应用  

Study and Application of Delay Cure Cationic Epoxy Adhesive

作　　者：付瑜 李炳辉 冷万里 田湛秋 Fu Yu;Li Binghui;Leng Wanli;Tian Zhanqiu(Dongguan Xinke Technology Research and Development Co.s Ltd.,Guangdong,523000)

机构地区：[1]东莞新科技术研究开放有限公司,广东523000

出　　处：《当代化工研究》2020年第23期1-4,共4页Modern Chemical Research

摘　　要：采用柔韧性环氧树脂,增韧剂,柔性稀释剂,阳离子引发剂和热致阳离子固化剂等制备了阳离子型延迟固化环氧胶粘剂(简称DCC Epoxy)。利用FTIR表征了DCC Epoxy的结构特征,通过DSC研究了DCC Epoxy的热反应特性。将DCC Epoxy用于硬盘磁头粘接,研究了开放时间(Open-Time),固化条件,剪切强度,以及磁头热框变化情况。结果显示DCC Epoxy具有优异的柔韧性,剪切强度和磁头热框变化满足磁头性能要求。与目前传统的丙烯酸酯类胶粘剂比较,没有氧阻聚现象,固化温度低,固化程度高,挥发物含量低,收缩率低,具有明显的应用优势。A delay cure cationic epoxy adhesive(DCC Epoxy) was prepared with flexible epoxy resin, toughening agent, flexible diluent, cationic initiator and thermally induced cationic cure agent. The structural characteristics of DCC Epoxy were characterized by FTIR, and the thermal reaction characteristics of DCC Epoxy were studied by DSC. The open-time, curing conditions, adhesive strength and the head thermal crown change were studied while DCC Epoxy was used to HGA head. The results show that DCC Epoxy has an excellent flexible feature, and the shear force and head thermal crown change meet the requirements of HDD head performances. Compared with the traditional acrylate adhesive, it has no oxygen inhibition phenomenon, low curing temperature, high curing degree, low volatile content and low shrinkage, which has obvious application advantages.

关 键 词：阳离子型延迟固化 环氧胶粘剂 硬盘磁头粘接 

分 类 号：TQ[化学工程]