回转件表面高强度铜的高速电铸试验研究  

Experimental Study on High-speed Electroformingof High-strength Copper on a Rotary Mandrel

作　　者：赵子俊 朱洪宇 薛子明 朱增伟[1] ZHAO Zijun;ZHU Hongyu;XUE Ziming;ZHU Zengwei(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)

机构地区：[1]南京航空航天大学机电学院,江苏南京210016

出　　处：《机械制造与自动化》2021年第1期41-44,共4页Machine Building & Automation

基　　金：南京航空航天大学开放课题项目(HTL-A-19G10)。

摘　　要：设计了一种回转阴极表面电铸液高速冲刷与高电流密度沉积交替进行的电铸铜加工方式,以提高回转件表面电铸铜沉积效率和沉积层质量。在溶液冲刷速度为3 m/s左右的条件下,分别以4、8、12、16 A/dm^2的电流密度进行电化学沉积,并对电铸铜层进行力学性能检测。检测结果显示:8 A/dm^2电流密度下获得的电铸层综合力学性能最优良,其显微硬度值为186.1 HV、抗拉强度达455 MPa、延伸率为20%;在12 A/dm^2及16 A/dm^2电流密度下电铸层力学性能略有下降,但是抗拉强度仍高于400 MPa。On the surface of rotary cathode surface,a copper electroforming method,by which high-speed flushing and high current density deposition operate alternately,was designed.This method was able to improve the copper depositing efficiency and quality of electroformed copper layer on the surface of the rotating mandrel.Electrochemical deposition at a current density of 4,8,12,16 A/dm^2.And the mechanical properties of the electroformed copper layer were carried out under the conditions of a solution with flow rate of approximate 3 m/s.The test results show that the deposition layer obtained at 8 A/dm^2 current density possesses the best comprehensive mechanical properties,and its microhardness value is 186.1 HV,tensile strength 455 MPa,elongation 20%,at 12 A/dm^2,and 16 A/dm^2 current density the mechanical properties of the electroformed layer decrease slightly,but the tensile strength remains higher than 400 MPa.

关 键 词：电铸铜 试验研究 力学性能 沉积速度 

分 类 号：V261.52[航空宇航科学与技术—航空宇航制造工程]