Microstructured Ultrathin Organic Semiconductor Film via Dip-Coating:Precise Assembly and Diverse Applications  

作　　者：Zhongwu Wang Shuguang Wang Lizhen Huang Liqiang Li Lifeng Chi 

机构地区：[1]Tianjin Key Laboratory of Molecular Optoelectronic Sciences,Department of Chemistry,Institute of Molecular Aggregation Science,Tianjin University,Tianjin 300072,China [2]Institute of Functional Nano&Soft Materials(FUNSOM)and Jiangsu Key Laboratory for Carbon-based Functional Materials&Devices [3]Collaborative Innovation Center of Suzhou Nano Science and Technology,Soochow University,Suzhou 215123,China

出　　处：《Accounts of Materials Research》2020年第3期201-212,共12页材料研究述评（英文）

基　　金：The authors are grateful to National Key Research and Development Program(2018YFA0703200,2016YFB0401100);National Natural Science Foundation of China(52073210,21573277,51503221);Tianjin Natural Science Foundation(19JCJQJC62600,194214030036);Key Research Program of Frontier Sciences of Chinese Academy of Sciences(QYZDB−SSW−SLH031).

摘　　要：CONSPECTUS:Organic semiconductors(OSCs)have led to considerable progress in various fields owing to their intrinsic flexibility,adjustable chemical structures,multifunctionalities,and low processing cost.The optoelectronic properties of OSCs greatly depend on their aggregation state in molecular assemblies.To obtain ideal and reliable optoelectronic performances,a highly controlled assembly method for modulating OSC packing structures is indispensable.In particular,ultrathin OSC microstructures consisting of one to several molecular layers,known as microstructured ultrathin organic semiconductor films(MUOSFs),are of great importance for both fundamental research and applications of OSCs.However,most reported film thicknesses or molecular layer numbers of ultrathin OSC films/microstructures are“average values”rather than“real values”and are not molecularly precise.The lack of an effective and general assembly strategy seriously hinders the progress of MUOSFs.In this Account,we summarize our recent progress in exploring the assembly strategy,the underlying mechanism,and diverse applications of MUOSFs prepared via dipcoating under optimized conditions.Dip-coating,with an intrinsic three-phase contact line,has a great advantage to precisely assemble ultrathin OSC films/microstructures.As an evaporation-controlled method,the assembly processes used in dip-coating are susceptible to multiple factors,such as pulling speed,molecular structures,and solution properties.Under the guidance of our proposed“Balance Principle”for adjusting these factors,uniform and continuous MUOSFs can be obtained over a large area.Under optimized conditions,the number of molecular layers of MUOSFs can be customized with monolayer precision,which is significant for investigating the charge transport mechanism of OSCs.At the same time,the ultrathin and partial coverage characteristics of MUOSFs are beneficial to fabricate flexible and transparent devices for wearable electronics.Notably,the morphologies and coverage of ultrathin mic

关 键 词：COATING PACKING film 

分 类 号：TB3[一般工业技术—材料科学与工程]