集成T形分液器的微通道散热器设计与实验  

Design and Experiment of Microchannel Heat Sink with T-shape Coolant Distributor

作　　者：赵文忠 殷黎明 周金柱[2] 李唐 ZHAO Wenzhong;YIN Liming;ZHOU Jinzhu;LI Tang(The 20th Research Institute of CETC,Xi’an 710068,China;Key Laboratory of Electronic Equipment Structure Design,Ministry of Education,Xidian University,Xi’an 710071,China)

机构地区：[1]中国电子科技集团公司第二十研究所,陕西西安710068 [2]西安电子科技大学电子装备结构设计教育部重点实验室,陕西西安710071

出　　处：《电子机械工程》2021年第1期23-27,共5页Electro-Mechanical Engineering

基　　金：国家自然科学基金资助项目(51775405,51905403);国防科研项目(TDGC-CL-19-052-2);陕西省自然基金资助项目(2019JM-010)。

摘　　要：微通道散热器具有热阻低、效率高、可与芯片集成加工等诸多优良特性,在电子设备散热领域具有非常广阔的应用前景,但传统微通道散热器存在通道内部流量不均匀、温度均匀性差的缺点。针对这些问题,文中设计了一种具有倒T形冷却液分配器的新型结构微通道散热器,以解决传统微通道散热器温度均匀性问题。仿真结果表明,在相同条件下,新型微通道散热器的最高温度比传统微通道散热器的最高温度降低了7:4223℃,温度均匀性提高了6:35157℃,进出口压降小了33 kPa。文中根据仿真结果研制了实验样件和实验系统。实验结果表明,该新型微通道具有好的温度一致性,在总发热功率为1440 W时,温度均方差小于2℃,并且仿真结果和实验测量结果的最大误差和平均误差分别为6.8%和1.37%。The microchannel heat sink has many good characteristics,such as low thermal resistance,high efficiency etc.,and can be processed after integrated with the chip,so it has a great application prospect in the field of electronic equipment heat dissipation.The internal flow and temperature of the traditional microchannel heat sink,however,are not uniform.To solve these problems,a new microchannel heat sink with an inverted T-shape coolant distributor is designed in this paper.The simulation results show that under that same conditions the highest temperature of the new microchannel heat sink is 7:4223℃ lower than that of the traditional microchannel heat sink;that the temperature uniformity is increased by 6:35157℃ and the import&export pressure drop is decreased by almost 33 kPa,compared with the traditional straight microchannel heat sink.According to the simulation results,a microchannel heat sink prototype and a test system are developed.The test results show that the temperature uniformity is within 2℃ when the total heating power is 1440 W;that the maximum and average temperature error of the heat source on the surface of the heat sink between the simulation and tests is 6.8% and 1.37%respectively.

关 键 词：微通道散热器 温度均匀性 数值模拟 

分 类 号：TK172[动力工程及工程热物理—热能工程]