Improvement of the Assembly between Cavity Flanges and the BCP Facility at IMP  

作　　者：Guo Hao Xiong Pingran Song Yukun You Zhiming Tan Teng 

机构地区：[1]不详

出　　处：《IMP & HIRFL Annual Report》2019年第1期301-302,共2页中国科学院近代物理研究所和兰州重离子研究装置年报（英文版）

摘　　要：The Buffered Chemical Polishing(BCP),consisting of one volume of 40%HF,one volume of 65%HNO_(3) and two volumes of 85%H_(3)PO_(4),has been considered as a popular method for etching the inner surfaces of niobium cavities after its fabrication,especially for lowβ(β<0.3)cavities.

关 键 词：IMP ETCHING fabrication 

分 类 号：TG1[金属学及工艺—金属学]