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作 者:何端鹏 于翔天[1] 王向轲[1] 邢焰[1] 高鸿[1] 李岩[1] HE Duanpeng;YU Xiangtian;WANG Xiangke;XING Yan;GAO Hong;LI Yan(Material Reliability Center,China Academy of Space Technology,Beijing 100094,China)
机构地区:[1]中国空间技术研究院材料可靠性中心,北京100094
出 处:《中国测试》2021年第1期42-48,共7页China Measurement & Test
基 金:电子元器件质量工程科研项目(2006WR0015,2019WR0012);电子元器件共性检测项目(1905WK0013)。
摘 要:为解决微纳尺度晶体材料膨胀系数无法直接测量的现状,文章提出一种适用的测试思路及计算方法。该方法基于材料在不同温度下的XRD衍射图谱获得晶胞晶格常数,通过"晶格常数-温度"拟合,计算各个物相晶轴的线膨胀系数,进一步计算获得材料的体膨胀系数。采用该方法对单相高锡焊料及多相PbSn合金焊球进行测试,获取其体膨胀系数,证实方法有效可行。该方法能够实现微纳尺度试样的体膨胀系数的测定,包括产品微构件、薄膜材料、电子元器件用引线及焊料等材料,具有对试样要求低、操作简单、表征高效的特点,为微纳晶体材料热膨胀系数的测定提供新思路,具有较强的应用价值。Herein, a method for measuring the volume coefficient of expansion of micro/nano-scale crystalline materials is proposed in order to solve the problem that the parameter is difficult to obtain directly. The volume coefficient of expansion of materials is calculated by using the linear expansion coefficient of crystal axes of each phase, which is available through linear fitting of lattice constant with temperature based on the calculated lattice constants from the XRD diffraction patterns at different temperatures. The examples of single-phase tin solder and multi-phase PbSn solder balls have proved the feasibility and effectiveness of the proposed method.This method can be used to measure the volume coefficient of expansion of micro/nano-scale samples,including the micro-sized structures, film materials, lead wires, solders and other materials for electronic components. This method is simple and efficient in operation without any specimen requirements. Therefore,the study provides a new way to measure the thermal expansion coefficient of micro/nano-scale materials,which has tremendous applicable value.
分 类 号:N34[自然科学总论] TB9[一般工业技术—计量学]
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