典型封装结构热疲劳寿命评估及试验技术  

Fatigue Life Evaluation and Test Method for Representative Printed Circuit Board

作　　者：童军[1] 王鹏辉[1] 黄佳 钟嫄 陈志军 Tong Jun;Wang Peng-hui;Huang Jia;Zhong Yuan;Chen Zhi-jun(Beijing Institute of Structure and Environment Engineering,Beijing,100076)

机构地区：[1]北京强度环境研究所,北京100076

出　　处：《导弹与航天运载技术》2021年第1期110-114,共5页Missiles and Space Vehicles

摘　　要：为了开展典型仪器设备结构的应力分析及寿命评估研究,利用工程算法和有限元分析方法对常见的封装管壳进行热环境下的应力分析,采用显微数字图像相关技术对焊点热应变进行全场测量,验证了计算模型的正确性和准确性,最后采用蠕变应变寿命评估模型和剪切应变寿命评估模型对焊点寿命进行了评估,并设计了CQFP68封装管壳的温循试验,验证了计算方法的可行性,形成了一套较为完整的板级仪器设备热环境下的寿命评估及试验验证技术。The engineering and FEM method is used to calculate the stress of representative printed circuit board on heat environment.The exactitude of this method is validated.The strain of welding jointing is tested by using the Micro-DIC technique.Finally,Creep strain life assessment model and shear strain life assessment model are used to assess the life span of solder joints.Temperature Cycle test is designed to validate the exactitude of CQFP68 Printed Circuit board.A complete set of life evaluation and test verification techniques are formed forprinted circuit board onheat environment.

关 键 词：仪器设备 热环境 工程算法 有限元 寿命 

分 类 号：V416.5[航空宇航科学与技术—航空宇航推进理论与工程]