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作 者:董浩 夏宇 虞鑫海[1] 刘艳婷 DONG Hao;XIA Yu;YU Xinhai;LIU Yanting(Department of Applied Chemistry,Donghua University,Shanghai 201620,China;Suzhou Jufeng Electrical Insulation System Limited,Suzhou 215200,China)
机构地区:[1]东华大学应用化学系,上海201620 [2]苏州巨峰电气绝缘系统股份有限公司,江苏苏州215200
出 处:《绝缘材料》2021年第2期9-13,共5页Insulating Materials
摘 要:为研制适用于干式变压器的高导热环氧灌封胶,在环氧-酸酐体系中添加实验室自制的改性氧化硅制备灌封胶,测试其导热性能和电气绝缘性能,并研究该灌封胶的适宜浇注温度及最佳固化工艺。结果表明:当改性氮化硅填充量为75%时,灌封胶的热导率为1.494 W/(m·K),介质损耗因数仅为0.41%,具有高导热性以及优异的电气绝缘性能。当浇注温度为70℃时,2 h内灌封胶的黏度低于2800 MPa·s,具有良好的浇注工艺性。灌封胶最佳的固化工艺为80℃真空/0.5 h+80℃/4 h+90℃/3 h+110℃/2 h+140℃/5 h,在该条件下灌封胶中粉体的沉降较小且固化物有最佳的综合性能。In order to develop a high thermal conductive epoxy potting adhesive for dry-type transformer,we prepared a potting adhesive by adding self-made modified silica to epoxy anhydride system.The thermal conductivity and electrical insulation performance were tested,and the suitable pouring temperature and best curing process of the potting adhesive were studied.The results show that when the filling content is 75%,the potting adhesive has high thermal conductivity and excellent electrical insulation performance,the thermal conductivity is 1.494 W/(m·K),the dielectric loss factor is only 0.41%.When the pouring temperature is 70℃,the potting adhesive has good pouring process,the viscosity is low than 2800 MPa·s within 2 h.The best pouring process for potting adhesive is 80℃vacuum/0.5 h+80℃/4 h+90℃/3 h+110℃/2 h+140℃/5 h.Under the condition,the deposition of powder in potting adhesive is small,and the cured product has the best comprehensive performance.
分 类 号:TM215.1[一般工业技术—材料科学与工程]
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