LED封装胶耐热性实验研究  

Experimental Study on Heat Resistance of LED Packaging Adhesive

作　　者：林远彬 秦快 文波 LIN Yuanbin;QIN Kuai;WEN Bo(Foshan NationStar Optoelectronics Co.,Ltd, Foshan 528000, China)

机构地区：[1]佛山市国星光电股份有限公司,广东佛山528000

出　　处：《照明工程学报》2021年第1期31-36,共6页China Illuminating Engineering Journal

基　　金：佛山市核心技术攻关项目(1920001000236)。

摘　　要：利用分光测色仪、光电测试机和推力测试机等测试手段,实验测定了不同加热烘烤条件下LED的色差、光电参数及树脂推力,研究了不同LED封装胶的耐热性差异,并为行业提供了LED产品的维修方案。The color difference,photoelectric parameters and resin thrust of LED under different heating and baking conditions were measured by means of spectrophotometer,photoelectric testing machine and thrust tester.The heat resistance difference of different LED packaging adhesives was studied,and the maintenance scheme for LED products was provided for industry.

关 键 词：色差 光电参数 树脂推力 LED封装胶 耐热性 

分 类 号：TQ31[化学工程—高聚物工业]