球型Al_(2)O_(3)-AlN颗粒复配填充型硅橡胶的制备及导热性能研究  

Study on the Preparation and Thermal Conductivity of Silicone Rubber Filled with Spherical Al_(2)O_(3)-AlN Particles

作　　者：张晨旭 毛大厦 曾小亮[1,2] 孙蓉 许建斌[1,3] 汪正平 ZHANG Chenxu;MAO Dasha;ZENG Xiaoliang;SUN Rong;XU Jianbin;WONG Chinping(Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China;Shenzhen Institute of Advanced Electronic Materials,Shenzhen 518103,China;Department of Electronics Engineering,the Chinese University of Hong Kong,Hong Kong 999077,China;School of Materials Science and Engineering,Georgia Institute of Technology,Atlanta 30332,USA)

机构地区：[1]中国科学院深圳先进技术研究院,深圳518055 [2]深圳先进电子材料国际创新研究院,深圳518103 [3]香港中文大学电子工程系,中国香港999077 [4]佐治亚理工学院材料科学与工程学院,亚特兰大30332

出　　处：《集成技术》2021年第1期14-22,共9页Journal of Integration Technology

基　　金：广东省基础和应用基础研究项目(2019A1515110845);中国科学院前沿科学重点研究项目(QYZDY-SSWJSC010);国家科技部重点研发项目(2017YFB0406000);中国科学院青年创新促进会基金项目(2019354);深圳市基础研究计划项目(JCYJ20200109114401708);深圳市科技与基础研究及学科布局项目(JCYJ20170818153048647)。

摘　　要：以Al_(2)O_(3)和AlN的球形粉体颗粒作为导热填料、以硅橡胶为基体,通过特定的工艺手段得到具有高导热特征的Al_(2)O_(3)-AlN/硅橡胶复合材料。结果表明:根据颗粒级配理论模型的计算可得最密堆积配方,该配方的复合材料在96 wt%填料填量下的热导率可高达9.6 W/(m·K),其热导率相比只填充Al_(2)O_(3)颗粒的样品提高了60%。复合材料热导率的显著提高和样品内部导热路径的增多密切相关。通过极端的冷热循环应用条件模拟测试,该复合材料的热导率保持良好,表现出了良好的可靠性。Al_(2)O_(3)-AlN/silicone rubber composites with high thermal conductivity were prepared by using spherical Al_(2)O_(3)and AlN as thermally conductive fillers.By using theory of granulartity,we obtained the densest packing of fillers in the polymer composites.The results showed that the thermal conductivity of the composites reached up to 9.6 W/(m∙K)at the loading of 96 wt%,which was 60%higher than that filled with Al_(2)O_(3).The significant increase of the thermal conductivity of the composites resulted from the increase of the internal thermal conductivity of the sample.Although the composites have undergone extreme cold and hot cycle application conditions,the thermal conductivity of the composites was maintained well,showing excellent reliability.

关 键 词：氧化铝 氮化铝 硅橡胶 热导率 

分 类 号：TG156[金属学及工艺—热处理]