聚合物/氮化硼复合导热材料研究进展  

Progress on Thermal Conductive Polymer/Boron Nitride Composites

作　　者：徐万顷 黄桃青 李永伟 陈敏[1] 武利民[1] Wanqing Xu;Taoqing Huang;Yongwei Li;Min Chen;Limin Wu(Department of Materials Science,Fudan University,the Advanced Coating Research Center of Ministry of Education of China,Shanghai 200433,China)

机构地区：[1]复旦大学材料科学系教育部先进涂料工程研究中心,上海200433

出　　处：《高分子材料科学与工程》2021年第1期284-291,共8页Polymer Materials Science & Engineering

基　　金：国家重点研发计划(2017YFA0204600,2018YFE0201701);国家自然科学基金资助项目(51673041)。

摘　　要：随着电子信息技术的发展,电子器件逐步趋于小型化、高功率与高密度集成化,其散热问题成为保障器件可靠性运转的关键。目前,聚合物材料由于成本低,成型工艺完善等优势,成为高性能导热材料研究重点。受制于聚合物较低的本征热导率,以高导热六方氮化硼(h-BN)作为填料改性的聚合物/BN复合材料,因兼具高导热性能与电气绝缘的双重优势,最有潜力解决电子器件高效散热问题。文中从h-BN片层剥离、表面改性及在基体中的取向排列等方面,介绍聚合物/BN复合导热材料近年来的研究进展。With the development of electronic information technology,electronic devices tend to be miniaturized,high-power and high-density integration.The heat dissipation becomes the key problem to ensure the reliable operation of the devices.At present,due to the advantages of low cost and perfect molding process,polymer materials have become the research focus of high-performance thermal conductive composite.Subject to the low thermal conductivity of polymer,the polymer/boron nitride composites modified with high thermal conductivity hexagonal boron nitride(h-BN)have the dual advantages of high thermal conductivity and electrical insulation,which have the most potential to solve the problem of efficient heat dissipation of electronic devices.In this paper,the research progress of polymer/BN thermal conductive composites in recent years was introduced from the aspects of h-BN exfoliation,surface modification and orientation arrangement in the matrix.

关 键 词：六方氮化硼 高导热复合材料 取向排列 柔性材料 

分 类 号：TB332[一般工业技术—材料科学与工程]